My E-Bond LC – One-Component Adhesive for Versatile Bonding Applications
Exhibitor
Bisico, Bielefelder Dentalsilicone GmbH & Co. KG
My E-Bond LC is a light-curing, one-component self-etch adhesive system developed for reliable bonding procedures in modern restorative dentistry.
Its versatile application concept allows dental professionals to choose between the self-etch technique and selective enamel etching, depending on the clinical requirements.
In self-etch mode, no separate phosphoric acid etching step is necessary, helping simplify the adhesive workflow. Selective enamel etching can be performed when additional enamel bond strength is desired.
My E-Bond LC is suitable for direct light-curing composite restorations, core build-ups using light- or dual-curing composites, and indirect composite or ceramic restorations such as inlays, onlays, veneers and crowns when used with appropriate luting composites. It can also be used for repairing fractured composite restorations.
The adhesive is applied to the prepared tooth surface, left to act for at least 20 seconds, air-thinned to evaporate the solvent and subsequently light-cured for 10 seconds under the specified conditions.
My E-Bond LC combines a straightforward application procedure with a broad range of restorative indications.
For dental professionals, it offers a flexible adhesive solution designed to support efficient workflows in both direct and indirect restorative dentistry.

My E-Bond LC